Description
Common Substrates
High Tg FR-4, aluminum base PCB, copper base PCB; high-temperature epoxy laminates; partial high-frequency hybrid heavy copper boards
Key Electrical Parameters
Available finished copper weight: 2oz, 3oz, 4oz, 6oz, 8oz, 10oz
Large conductive cross-section and low DC resistance of traces
Superior thermal conductivity to assist component heat dissipation
Withstand instantaneous high surge current
Manufacturing Capabilities
Layers: 1 ~ 16 layers
Precise heavy copper etching control to prevent undercut and trace notching
Support combined processes: heavy copper + resin plug vias, heavy copper impedance boards, heavy copper step boards
Surface finishes: HASL, ENIG, hard gold plating etc.




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