Blind & Buried Via PCB

Blind vias connect outer layers to inner layers, while buried vias interconnect inner layers without penetrating the entire board. They efficiently save board area, realize ultra-high density routing, reduce PCB dimensions and shorten signal traces to improve signal integrity. Widely adopted in HDI boards, server mainboards, optical modules, compact RF modules and high-end consumer electronics.

Description

Common Substrates
High Tg FR-4, halogen-free laminates, low-loss high-speed materials, Rogers high-frequency substrates

Key Electrical Parameters
Shorten signal paths and reduce crosstalk & transmission loss
Facilitate continuous impedance design and minimize signal discontinuities caused by vias
Improve routing efficiency to accommodate more I/O pins within the same dimension

Manufacturing Capabilities
Layers: 4 ~ 24 layers
Structures: 1-stage blind & buried vias, 2-stage blind & buried vias, stacked microvias, resin plug vias
Minimum laser microvia: 0.075mm
Minimum mechanical buried via: 0.15mm
Balanced copper thickness control to avoid lamination voids and delamination