Lead-Free HASL (LF-HASL)

Lead-Free HASL is an upgraded environmental version of traditional HASL, adopting pure tin coating without lead composition. It complies with global RoHS environmental regulations while retaining the high solderability and cost advantages of spray tin technology. It is the most cost-effective lead-free surface finish for mass production of medium and low-end PCBs, perfectly adapting to most conventional lead-free soldering processes.

Description

Specifications & Functional Features
– Surface Material: Pure Tin (Lead-Free)
– Coating Thickness: 1.2μm – 3.0μm
– Compliance: Fully RoHS & REACH compliant
– Solderability: Good, stable performance for multiple reflow soldering
– Surface Flatness: Moderate, better than traditional leaded HASL
– Process Advantage: Cost-efficient, environmentally friendly, high production speed, strong applicability for mass orders
– Limitations: Not applicable for ultra-fine line width and high-precision BGA packaging
– Typical Applications: Mass consumer electronics, automotive ordinary circuits, industrial control equipment, communication basic boards

Working Principle & Process Diagram Description
Working Principle: Eco-friendly physical hot air leveling process. Replace tin-lead alloy with high-purity molten pure tin. The cleaned copper pads absorb pure tin solder, then hot air trimming removes redundant tin to form a dense pure tin protective layer on copper surface, achieving anti-oxidation and lead-free soldering performance.
Process Flow: Acid Cleaning → Micro Etching → Flux Application → Lead-Free Pure Tin Dipping → Hot Air Leveling → Drying & Quality Check