Description
Multilayer PCB (MLB)
Consists of three or more conductive layers separated by insulating prepreg and laminated together. Inner layers are often used as power layers and ground layers. Suitable for complex, high-speed, high-density electronic systems.
Additional information
| Item | Multilayer PCB(Multilayer Printed CircuitBoard, MLB) |
|---|---|
| Conductive Layers | >3 conductive copper layers(top, bottom + inner layers) |
| Via Structure | Through vias, buried vias,blind vias available forinterlayer connection |
| Wiring Density | High & ultra-high wiringdensity |
| Cost Level | High; rises sharply with layercount |
| Manufacturing Cycle | Longer; more complexamination process |
| Electrical Performance | Excellent. Built-in powerplanes & ground planesgood EMC & high-speedsignal stability |
| Typical Applications | Servers, motherboards,communication equipment,automotive PCBs, medicalelectronics, high-speedcircuit boards |
| Main Limitation | Higher cost, longer leadtime, harder rework |
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