Product Overview

This product is a 4-layer printed circuit board (PCB) with tin-sprayed surface finish and metal edge wrapping technology, designed for applications requiring enhanced shielding performance, stable electrical connectivity, and reliable solderability. The 4-layer stack-up ensures efficient signal routing, while the tin spraying and metal edge wrapping improve durability and electromagnetic compatibility (EMC).

Key Features

• 4-layer multilayer structure: Supports stable power distribution and complex circuit routing

• Tin-sprayed surface finish: Provides excellent solderability and anti-oxidation protection

• Metal edge wrapping design: Enhances shielding, grounding continuity, and mechanical strength

• Improved EMC performance: Reduces electromagnetic interference (EMI) in high-frequency environments

• Strong structural reliability: Reinforced edges improve durability during assembly and operation

• Cost-effective shielding solution: Combines performance and manufacturability

Technical Specifications

• Layer count: 4 layers

• Base material: FR-4 / high-Tg FR-4 (optional)

• Surface finish: Tin spraying (Sn coating)

• Edge treatment: Metal edge wrapping (conductive plating or shielding wrap)

• Tin thickness: 5–30 μm (customizable)

• Copper thickness: 1 oz / 2 oz (customizable)

• Board thickness: 0.8 mm – 2.4 mm

• Minimum trace/space: 4/4 mil (depending on design capability)

• Operating temperature: -40°C to 130°C (standard FR-4)

Applications

• Communication equipment and RF modules

• Industrial control systems

• Automotive electronic control units (ECUs)

• Power supply systems

• High-speed digital circuits

• EMI-sensitive electronic devices

• Embedded control boards

Advantages

Compared with standard 4-layer tin-sprayed PCBs, this metal edge wrapped design provides:

• Better electromagnetic shielding and signal integrity

• Improved grounding performance across board edges

• Enhanced mechanical robustness during assembly and vibration

• Reduced EMI leakage in high-frequency applications

• Longer service life in harsh operating environments

Customization Options

• Edge wrapping method (full wrap / partial / selective grounding)

• Tin thickness adjustment

• Base material selection (FR-4, high-Tg FR-4)

• Stack-up design optimization

• Copper weight and impedance control

• Solder mask color options (green, black, blue, red, white)

Quality Assurance

Each PCB is manufactured under strict quality control processes, including:

• Electrical testing (E-test)

• AOI (Automated Optical Inspection)

• Impedance and continuity verification

• Edge plating adhesion testing

• Solderability testing

• Dimensional and structural inspection