2–8 Layer Rigid-Flex Boards (Rigid-Flex Printed Circuit Boards)

2–8 Layer Rigid-Flex Boards are composite circuit boards integrating rigid PCB layers and flexible FPC layers organically. The rigid areas adopt high-hardness FR-4 substrate for component soldering and fixed installation, while the flexible areas adopt high-flex PI substrate for bending and movable connection. Integrated 2 to 8 layered circuit design, it combines the structural stability of rigid boards and the bending flexibility of flexible boards, eliminating the need for connector assembly, reducing product volume and improving system reliability.

Description

Composite Structure: Rigid FR-4 substrate layer + flexible PI substrate layer + multi-layer interlayer lamination + precision via hole conduction; Integrated rigid-flex hybrid structure
Layer Range: Standard 2/4/6/8 integrated rigid-flex layers; Custom layered structure design for rigid and flexible zones
Material Matching: Rigid zone: FR-4 high-temperature resistant substrate (Tg≥130℃); Flexible zone: High-flex PI substrate; High-reliability bonding adhesive for rigid-flex transition zone
Precision Processing: Minimum line width/spacing 0.06mm/0.06mm; Minimum via diameter 0.12mm; Accurate alignment of rigid-flex transition boundary
Bending & Structural Performance: Flexible zone supports repeated bending (≥15,000 cycles); Rigid zone has high hardness and flatness, suitable for SMT component mounting
Electrical Performance: Integrated multi-layer circuit transmission, supports high-power and high-speed signal transmission; Stable impedance control, low signal attenuation
Environmental Reliability: Passes thermal shock, humidity resistance, vibration and drop tests; No layer separation or circuit failure in rigid-flex transition area
Key Features: Integration of rigidity and flexibility, no connector needed, high structural integration, high system stability, space and cost saving
Typical Applications: Aerospace equipment, automotive electronics, industrial intelligent terminals, precision medical devices, foldable intelligent electronic products