Description
Basic Structure: Standard single/double/multilayer FPC base + conductive shielding layer + insulating protective layer; Integrated grounding shielding design
Shielding Material: Nano silver shielding film, copper-nickel alloy shielding coating, conductive cloth shielding layer (optional according to frequency band requirements)
Shielding Performance: Electromagnetic shielding efficiency ≥90dB (10MHz~10GHz frequency band); Effectively suppress EMI/EMC interference and signal radiation
Circuit Specifications: Compatible with conventional FPC precision parameters (minimum line 0.05mm, microvia holes); Supports impedance control customization
Bending Performance: Shielding layer and circuit layer fit tightly, no peeling during bending; Dynamic bending cycles ≥20,000 times with stable shielding effect
Electrical Performance: Low signal loss, high anti-crosstalk capability; Stable transmission of high-frequency and high-speed signals
Environmental Resistance: Shielding layer is wear-resistant, oxidation-resistant and moisture-proof; Adaptable to complex industrial and consumer electronic working environments
Key Features: Excellent electromagnetic shielding performance, high signal stability, anti-interference, wear-resistant and durable, compatible with flexible bending
Typical Applications: 5G terminal equipment, automotive intelligent control modules, wireless communication devices, industrial control precision equipment, high-frequency signal transmission modules


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