Ultra-thin FPC (Ultra-thin Flexible Printed Circuit Board)

Ultra-thin FPC is a customized lightweight and ultra-slim flexible circuit board developed for extreme miniaturization electronic equipment. Adopting ultra-thin PI substrate and micro-thin copper foil manufacturing process, it achieves ultra-low thickness while retaining excellent flexibility and electrical stability. Breaking the thickness limit of conventional FPC, this product is specially designed for ultra-thin, ultra-light and narrow-space assembly scenarios, enabling more compact structural design of terminal equipment.

Description

Overall Thickness: Total board thickness 0.03mm~0.1mm (ultra-thin customized); Far thinner than standard FPC (0.15mm+)
Core Materials: Ultra-thin PI substrate (12.5μm/7.5μm); 9μm/12μm ultra-thin high-flex rolling copper; Micro-thin low-viscosity insulating adhesive
Structural Types: Single-layer, double-layer and 3~4-layer ultra-thin structures available for customization
Processing Precision: Minimum line width/spacing 0.06mm/0.06mm; Micro-mini via hole processing, high-density fine wiring
Flexibility Performance: Super flexible, supports 360° free bending and folding; Bending cycles ≥25,000 times, no circuit damage
Electrical Performance: Stable low-current and high-speed signal transmission; Low dielectric loss, excellent insulation performance
Mechanical Performance: High tensile strength, anti-tearing, strong structural toughness, adaptable to frequent folding and extrusion
Operating Temperature: -30℃ ~ +120℃, stable performance in narrow and extreme installation spaces
Key Features: Ultra-slim thickness, ultra-light weight, super flexibility, high structural toughness, fine circuit integration
Typical Applications: Ultra-thin tablet computers, foldable screen devices, miniature medical probes, ultra-thin wearable watches, precision microelectronic modules