Description

Structure: 3~12 layered conductive copper layers + multi-layer PI insulating medium + interlayer via conduction + overall coverlay protection
Layer Count: Standard 3/4/6/8 layers; Customized 10/12 high-layer configurations available
Substrate & Adhesive: High-temperature resistant PI substrate (25μm/50μm); Low-flow high-insulation prepreg adhesive for interlayer lamination
Copper Foil Specification: 12μm/18μm high-purity rolling copper for signal layers; 35μm/70μm thick copper for power layers
Precision Parameters: Minimum line width/spacing 0.05mm/0.05mm; Minimum microvia diameter 0.1mm; High-precision impedance control (±5Ω tolerance)
Bending Performance: Professional layered structural design, dynamic bending cycles ≥30,000 times, no layer separation or circuit open/short circuit
Electrical Performance: Supports high-speed signal transmission (up to 10Gbps); Excellent impedance matching, low signal attenuation; Insulation resistance ≥10¹³ Ω
Environmental Performance: Passes high-low temperature cycle test (-40℃~135℃), humidity resistance and thermal shock resistance tests
Key Features: Ultra-high circuit density, multi-signal integration, strong EMI resistance, stable high-speed transmission, ultra-thin miniaturization
Typical Applications: 5G communication devices, drone modules, medical precision instruments, automotive electronic control systems, high-end wearable smart devices