Double Layer FPC (Double-Sided Flexible Printed Circuit Board)

Double Layer FPC is upgraded from single-layer flexible boards, equipped with double-sided conductive copper layers and reliable plated through-holes for interlayer electrical connection. It realizes double-sided circuit wiring, effectively improving circuit density and wiring efficiency compared with single-layer FPC. Balancing flexibility and circuit integration capability, this product is suitable for medium-complexity electronic interconnection systems, perfectly meeting the dual requirements of space saving and multi-circuit transmission.

Description

Structure: Double-sided copper circuit layers + PI dielectric substrate + plated through-hole interconnection + double-sided coverlay protection
Substrate Material: High-flexibility PI substrate, thickness 25μm / 50μm / 75μm (customizable)
Copper Foil Specification: 18μm / 35μm rolling copper (high bending resistance); 12μm ultra-thin copper for high-precision wiring
Via Hole Capability: Minimum via hole diameter 0.15mm; Minimum hole pitch 0.3mm; 100% electrical continuity test for vias
Line Precision: Minimum line width/spacing 0.07mm/0.07mm; Higher wiring density than single-layer FPC
Bending Performance: Dynamic bending cycles ≥20,000 times; Maintains stable electrical performance under frequent bending and twisting
Electrical Performance: Working voltage up to 500V; Insulation resistance ≥10¹³ Ω; Low impedance signal transmission
Operating Temperature: -40℃ ~ +130℃, excellent high and low temperature resistance
Key Features: Double-sided wiring, higher circuit integration, reliable interlayer conduction, moderate cost, strong environmental adaptability
Typical Applications: Smart home devices, medical wearable equipment, automobile miniature sensors, precision consumer electronics