Single Layer FPC (Single-Sided Flexible Printed Circuit Board)

Single Layer FPC is the most fundamental type of flexible circuit board, featuring a single conductive copper layer laminated on flexible dielectric substrate with protective coverlay. It is designed for simple circuit interconnection scenarios with low component density, delivering ultra-light weight, excellent bending flexibility and cost-effective performance. This entry-level flexible board is widely adopted in compact electronic devices that require basic bending and wiring functions, serving as an ideal solution for low-cost, space-constrained circuit connection demands.

Description

Copper Foil Specification: Rolling copper/electrolytic copper, thickness 18μm / 35μm (standard), 12μm (ultra-thin option)
Line Capability: Minimum line width/spacing 0.08mm/0.08mm; Maximum circuit density for single-layer wiring
Bending Performance: Supports repeated dynamic bending (≥10,000 cycles) with stable conductivity; Static bending angle up to 180°
Electrical Performance: Working voltage up to 300V; Insulation resistance ≥10¹² Ω; Dielectric strength ≥100KV/mm
Operating Temperature: -40℃ ~ +125℃ (PI substrate); -20℃ ~ +80℃ (PET substrate)
Key Features: Ultra-thin, ultra-light, high flexibility, simple manufacturing process, low production cost, fast delivery
Typical Applications: Keyboard membrane circuits, LED strip lights, wearable device simple wiring, consumer electronic auxiliary connections